MIL-PRF-19500/548H
3.4.1 Lead finish for 4N47, 4N47A, 4N48, 4N48A, 4N49, 4N49A. Lead finish shall be solderable in accordance
with MIL-STD-750, MIL-PRF-19500, and herein. Where a choice of lead finish is desired, it shall be specified in the
acquisition document (see 6.2).
3.4.2 Lead finish for 4N47U, 4N48U, 4N49U, 4N47BU, 4N48BU, and 4N49BU. Terminal pad shall be tungsten co-
fired to the ceramic package. Terminal pad finish shall be gold plated or solder dipped. Where a choice of lead finish
is desired, it shall be specified in the acquisition document (see 6.2).
3.4.3 Die shear. Die shear process control for eutectic alloyed die of less than 1.5 X 10-5 square inches of surface
area shall be in accordance with the requirements for small area die in method 2019 of MIL-STD-883. Die shear is
not required for the light emitting diode.
* 3.4.4 Moisture content. The internal moisture content of the device package shall not exceed 10,000 ppm at
+100°C.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I and II.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4 and tables I and II).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein shall be performed by the first inspection lot of this revision to
maintain qualification. Group E qualification by extension may be granted for this specification if the qualifying activity
determines it is structurally identical to other qualified devices.
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