MILPRF19500/572C
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MILPRF19500, MILSTD750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.3).
3.5 Marking. Marking shall be in accordance with MILPRF19500. Manufacturer's identification and date code
shall be marked on the devices. Initial container package marking shall be in accordance with MILPRF19500.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
b.
Screening (see 4.3).
c.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MILPRF19500 and as specified
herein.
4.2.1 Group E qualification. The group E inspections of table II herein shall be performed for qualification or
re-qualification only. In case qualification was awarded to a prior revision of the specification sheet that did not
require the performance of group E inspection, the tests specified in table II herein that were not performed in the
prior revision shall be performed on the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANTXV and JANTX levels). Screening shall be in accordance with table EIV of MILPRF19500
and as specified herein. Specified electrical measurements shall be made in accordance with table I herein. Devices
that exceed the limits of table I herein shall not be acceptable.
Measurements
Screen
see table EIV of
JANTX level
Method 1071 of MILSTD750, fine leak, test condition H (leak testing
30 minutes after pressurization is acceptable.)
7
Method 1071 of MILSTD750, gross leak, test condition C, except that
leak indicator fluid shall be maintained at +100°C ±5°C.
9 and 10
Not applicable.
11
Subgroup 2 of table I herein.
IF = 35 mA dc; TA = +25°C, t = 168 hours.
12
Subgroup 2 of table I herein; ĆIV1 = 20 percent of initial readings.
13
ĆVF = ±50 mV dc.
5
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