52104 \(Clear Lens\)This specification covers the performance requirements for hermetically-sealed green discrete and panel mount light emitting diodes. Two levels of product assurance are provided for each device type as specified in MIL┬ûPRF┬û19500.

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MIL�PRF�19500/521E

TABLE III. Group E inspections (all quality levels) for qualification only.

Quality conformance

Inspections

inspection sample size

Method

Conditions

Subgroup 1

45 devices, c = 0

Temperature cycling

1051

Test condition A, except that the hot

temperature shall be +100�C, +15�C / -0�C,

20 cycles.

Hermetic seal

1071

Fine leak

Gross leak

Electrical measurements

See tables I and II, subgroup II.

Subgroup 2

45 devices, c = 0

Intermittent operating life

1037

For all devices with organic material.

Electrical measurements

See tables I and II, subgroup II.

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order

(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel

need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are

maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or

within the Military Service s system commands. Packaging data retrieval is available from the managing Military

Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible

packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. The

notes specified in MIL�PRF�19500 are applicable to this specification.)

6.1 Intended use. Semiconductors conforming to this specification are intended for original equipment design

applications and logistic support of existing equipment.