52004 \(Clear Lens\)This specification covers the performance requirements for hermetically-sealed yellow discrete and panel mount light emitting diodes. Two levels of product assurance are provided for each device type as specified in MIL┬ûPRF┬û19500.

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MIL�PRF�19500/520E

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as

specified in MIL�PRF�19500 and herein.

Peak operating forward pulse current.

Peak transient forward current.

Iptr

Luminous intensity (the subscript V is used to designate a photometric or visual quantity to

differentiate from I as used herein for current).

λV

Peak radiometric wavelength of diode light emission.

mcd

Milli-candela; the candela is a unit of luminous intensity defined such that the luminance of a

blackbody radiator at the temperature of solidification of platinum is 60 candelas per square

centimeter.

The angle at or off the axis of symmetry of a light source at which luminous intensity is measured.

3.4 Interface and physical dimensions. The interface requirements and physical dimensions shall be as specified

3.4.1 Lead finish. Unless otherwise specified, the lead finish shall be solderable as defined in MIL�PRF�19500,

MIL�STD�750 and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document

(see 6.2).

3.4.2 Polarity. The polarity of the device types shall be as shown on figures 1 and 2.

3.4.3 Terminal lead length. Terminal lead lengths other than that specified on figures 1 and 2 may be furnished

when so stipulated in the acquisition document (see 6.2) where the devices covered herein are required directly for

particular equipment-circuit installation or for automatic-assembly-technique programs.

3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and tables I and II herein.

3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in tables I and II

herein.

3.7 Marking. Devices shall be marked as specified in MIL�PRF�19500.

3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

Qualification inspection (see 4.2).

Screening (see 4.3).

Conformance inspection (see 4.4 and tables I and II).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL�PRF�19500 and as specified

herein.

4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case

qualification was awarded to a prior revision of the specification sheet that did not request the performance of table III

tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on the first

inspection lot of this revision to maintain qualification.